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Advanced Electronics Packaging Digest: Third Issue Arrives November 17

11/12/2025 | I-Connect007
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

The Technical Backbone of an EMS Company: A CEO’s Perspective

11/12/2025 | Jay Rupani, Precision PCB
As the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

11/12/2025 | ASE Group
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd.,  announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.

Elementary, Mr. Watson: The Four Horsemen of Copper Confusion

11/12/2025 | John Watson -- Column: Elementary, Mr. Watson
If there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.

Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design

11/11/2025 | Team Alpha -- Column: Alpha Insights: Performance by Design
Power isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.
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