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Henger Announces Delivery of 400 Plasma Equipment Units and Launch of Their Second Plant
November 14, 2025 | HengerEstimated reading time: 1 minute
Zhuhai Henger Microelectronics Equipment Co., Ltd. announced the successful delivery of its 400th PCB plasma equipment unit and the official inauguration of the plasma workshop at its second plant on November 11. These milestones mark a significant advancement in the company’s technological development and production capacity.
The delivery of 400 plasma equipment units reflects seven years of continuous research, innovation, and process optimization. This achievement demonstrates strong market recognition and highlights the company’s mission to establish a leading national brand in plasma industrial applications, contributing to the growth of China’s PCB industry.
The commissioning of the second plant represents a major capacity upgrade. With expanded annual output, Henger is positioned to provide more efficient and reliable equipment supply to customers worldwide. Current product coverage includes Mainland China and Southeast Asia, with accelerated expansion into high-end global markets.
From technological breakthroughs to capacity expansion, and from domestic substitution to international deployment, Henger has established itself as a rising force in the plasma equipment industry. The delivery of the 400th unit and the launch of the second plant are not only milestones in company development but also important contributions to the localization and independence of the equipment sector.
Looking forward, Zhuhai Henger Microelectronics Equipment Co., Ltd. will continue to pursue innovation-driven growth and customer-focused strategies, delivering high-quality “China Solutions” for the PCB and semiconductor industries.
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BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper
04/15/2026 | BEST Inc.BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.
Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
04/14/2026 | Jesse Vaughan -- Column: Beyond the BoardAs mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
BTU Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region
04/08/2026 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026.
SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% YoY
04/08/2026 | SEMIWorldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported.