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Why Reliability Matters More Than Ever—Ultra HDI Podcast Episode 9 Now Streaming
November 21, 2025 | I-Connect007Estimated reading time: Less than a minute
What does it take to design for ultimate reliability? Find out in Episode 9 of I-Connect007’s acclaimed podcast series, On the Line With… American Standard Circuits: Ultra HDI.
In “High-Reliability Applications,” host Nolan Johnson and John Johnson of American Standard Circuits discuss how UHDI technology is enabling engineers to deliver stronger, more sustainable solutions in high-stakes industries.
Listen now on all major podcast platforms, including Apple Podcasts and Spotify, and download free takeaways from each episode to keep your UHDI knowledge both current and practical.
About the On the Line With… Ultra HDI Series
This 12-part podcast series from I-Connect007 explores the processes, materials, and design considerations driving ultra-high-density interconnect (UHDI) technology. Each episode features insights from industry experts who share best practices, innovations, and strategies shaping the future of advanced electronics manufacturing.
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Rachael Temple - AlltematedSuggested Items
Design007’s Top 10 Reader’s Picks for 2025
01/08/2026 | Nolan Johnson, I-Connect007The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/19/2025 | Nolan Johnson, I-Connect007We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Final Episode of I-Connect007’s UHDI Podcast Series Now Available On Demand
12/17/2025 | I-Connect007I-Connect007 announces the release of the final episode of its podcast series, On the Line With… American Standard Circuits: UHDI. Episode 12, titled “UHDI? It Depends,” brings the series to a close with an engaging, FAQ-driven discussion addressing the PCB industry’s most common questions about ultra-high-density interconnect (UHDI) technology.
On the Line With… Releases Episode 11: Beyond UHDI—The Future of PCB Technology
12/10/2025 | I-Connect007I-Connect007 is pleased to announce the release of Episode 11 of On the Line With… American Standard Circuits: Ultra HDI. In this episode, host Nolan Johnson continues his conversation with ASC’s John Johnson, turning the spotlight toward the next decade of PCB innovation and what lies beyond today’s breakthroughs in Ultra High Density Interconnect (UHDI).