Mehul Davé: A World Full of Opportunities and Possibilities

Estimated reading time: 2 minutes

In this interview, entrepreneur, technologist, and global visionary I-Connect007 columnist Mehul Davé reflects on a lifetime of innovation. From founding companies and mentoring teams to shaping global supply chains, Mehul discusses leadership, culture, and optimism for a thriving PCB future—reminding us that “chips don’t float,” and opportunity is everywhere.

Marcy LaRont: Mehul, tell us about yourself. Where were you born and raised? What is a favorite childhood memory you would be willing to share?

Mehul Dave: I was born in Ahmedabad, India. My parents were teachers, and I was raised by my maternal grandparents, who were very wealthy, so I was a spoiled brat until I was 6. My grandfather was a successful businessman, and I know it’s where my entrepreneurial drive came from.

In 1961, at age 6, I was sent to Chicago to be with my parents. At that time, your people went to the airport or train station to send you off on a long journey, and about 100 people came to see me off. My grandmother made a garland of sandalwood flowers, and she stitched figs, dates, and cashews in between the flowers, so if I got hungry, I could pluck them off the garland.

Mehul, where did you attend college, and what did you study? 

I received my degree in Mechanical and Aerospace Engineering from the Illinois Institute of Technology. I attended Governors State University (part of the University of Illinois system) to pursue my master’s degree in environmental sciences and systems analysis. I started a Ph.D. in Space Physics at the University of Michigan in Ann Arbor but never finished.

How did you get into this industry specifically? 

After university, I worked as a research scientist at Argonne National Laboratory near Chicago for seven years. I worked on the SDI initiative, commonly known as “Star Wars,” during Reagan's presidency. We were developing satellites to shoot down Russian missiles and satellites. 

To continue reading this article, which originally appeared in the November 2025 edition of PCB007 Magazine, click here.