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Advanced Electronics Packaging Digest

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Linde to Invest $1 Billion to Support Major U.S. Semiconductor Facility Expansion

08/03/2026 | BUSINESS WIRE
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The White House and the Department of Commerce announced an incremental $100 billion investment by TSMC for advanced semiconductor manufacturing and packaging facilities in Arizona.

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QuantumDiamonds GmbH (QD), one of Europe's fastest-growing semiconductor equipment companies, announced the closing of a €91 million funding round to scale production of its quantum-based semiconductor inspection technology.
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