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Summit Interconnect’s Leadership in the ‘Silicon Prairie’
December 5, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Summit Interconnect is one of the two largest PCB fabricators in the United States. I visited with Deepak Makwana, general manager of Summit’s Chicago plant, Business Development Manager Tom Veitch, and Vice President of Technology Gerry Partida at their Schaumberg, Illinois (Summit Chicago) facility to learn more about the evolution of PCB manufacturing in the Midwest. They highlight not only Summit’s comprehensive solutions through the Chicago facility, but the remarkable transition in Chicago and the Midwest from conventional manufacturing and the Rust Belt to becoming the “Silicon Prairie.”
Marcy LaRont: Good morning, gentlemen. Let’s start with some background and history around manufacturing in the Midwest. While there has been a significant amount of PCB fabrication in Chicago for some time, it may have traditionally been characterized as less sophisticated manufacturing.
Tom Veitch: Yes, I grew up in the Midwest, and the whole tradition of Midwest manufacturing was rooted in heavy machinery—automotive and steel-related industries.
The Midwest has long been defined by its manufacturing tradition. Historically, the region was rooted in heavy machinery, automotive, and steel industries – at one point accounting for approximately one-third of all manufacturing jobs in the United States. The technology of that era primarily supported lower-tech industries, while higher-tech work was concentrated on the East and West coasts. As globalization accelerated and cost rose, many manufacturing jobs left the U.S., giving rise to the “Rust Belt” label. This shift forced the Midwest manufacturing paradigm to evolve.
To continue reading this interview, which originally appeared in the November 2025 edition of PCB007 Magazine, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.