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Advanced Electronics Packaging Digest

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Connect the Dots: PCB Manufacturing Focused on Value

06/29/2026 | Matt Stevenson -- Column: Connect the Dots
PCB manufacturing has become more complex, not only to meet the growing need for more advanced, smaller boards, but also to address supply chain disruptions and uncertainty about the cost of critical raw materials. This environment makes it harder for our customers, too. Relatively straightforward decisions about choosing a PCB manufacturer have become more challenging.

Scanfil Advances Social Sustainability Across Own Workforce and Workers in the Value Chain

06/26/2026 | Scanfil
People and partnerships are at the core of Scanfil’s sustainability work. In 2025, Scanfil made measurable progress in advancing social sustainability within its own workforce and the workers in the value chain.

Scanfil Customer Survey Shows Strong Satisfaction, Record Engagement

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Scanfil’s latest customer survey results show solid overall performance and continued high customer engagement across its global operations.

Right-sizing Silver: An Application-driven Approach to Engineering Reliability

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Rising cost pressure and metals market uncertainty are prompting manufacturers to rethink alloy composition to balance total cost of ownership, process yield, and mechanical performance. Solder alloy selection directly influences cost structure, process stability, and long‑term reliability in electronics assembly. As manufacturing scales and product requirements advance, these decisions are increasingly revisited with a more focused objective: aligning materials with how products are built, processed, and used in real‑world conditions.

Techno System Announces ECO & ECO BOX Platform

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