-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Global Electronics Association Invites Electronics Design Professionals to the 2nd Pan-European Electronics Design Conference (PEDC)
December 15, 2025 | Global Electronics AssociationEstimated reading time: 1 minute
The Global Electronics Association invites designers, engineers, researchers, and product‐development leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague.
Hosted by Fachverband Elektronikdesign und ‑fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community.
The conference connects the European electronics industry and the scientific community, exploring the latest developments in electronics design from “silicon to systems.” Topics include design for excellence (DfX), tools and workflows to bridge software and hardware design, and electronic systems design process for electronics assemblies.
What is PEDC 2026?
- A two-day programme of technical sessions and keynote panels covering the "silicon to systems" spectrum fully — from development and design tools to manufacturing and sustainability.
- Conference tracks span AI and software tools, DfX, sustainable design and product life cycle and package-PCB-system co-design.
- High-quality, peer-reviewed technical content and insights from European industry and academia.
- Knowledge accelerator through network with peers, experts, and global leaders.
Key Conference Highlights
- Opening special session: “AI in Product Development: Separating Hype from Reality” with industry leader Tomide Adesanmi, Circuit Mind; followed by a panel discussion featuring thought leaders from Altium, Cadence, Siemens and Zuken
- A dedicated track on sustainable design, materials and processes, addressing circularity and lifecycle optimization.
- Hands-on technical presentation featuring case studies in silicon-to-systems/package–PCB–co-design, showcasing advanced design integration strategies.
“With this newly formatted second PEDC, we want to build on the success of last year’s event,” said Peter Tranitz, senior director of technology solutions at the Global Electronics Association. “As with the first edition, a Europe-wide panel of experts will develop a high-quality technical programme that remains fully independent and free from commercial influence.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.