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North American PCB Demand Strengthens as July Bookings Surge 62%

08/25/2026 | Global Electronics Association
The Global Electronics Association announced the July 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.46.

MKS’ Atotech Showcases Copper Via-Fill Solutions for Next-Gen RDL at SEMICON Taiwan

08/25/2026 | Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced that Dr. Britta Schafsteller, Global Product Manager Semiconductor at MKS’ Atotech, will speak at the upcoming Heterogeneous Integration Global Summit during SEMICON Taiwan.

SCHMID Group Reports €46.0 Million 1H 2026 Revenue, Updates Full-Year Guidance

08/25/2026 | SCHMID Group
SCHMID Group N.V., a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, reports its unaudited financial results for the first half of 2026, covering the period ended June 30, 2026, and adjusts its full-year 2026 guidance.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

Elementary, Mr. Watson: PCB Design is a Team Sport (Revisited)

08/26/2026 | John Watson -- Column: Elementary, Mr. Watson
At the Tokyo 2020 Olympics, the U.S. men’s 4x100-meter relay team of Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie was expected to contend for gold. With some of the fastest sprinters in the world, simply reaching the final seemed almost certain. Instead, the heavily favored team finished sixth in its qualifying heat and failed to advance, missing the final by just two-hundredths of a second. This massive disappointment was not due to a lack of individual speed but to a poorly executed baton exchange between Kerley and Baker, which forced both runners to slow down at the most critical moment.
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