It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
ECTC 2026 Announces Student Innovation Challenge
December 23, 2025 | ECTCEstimated reading time: 1 minute
The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced a Student Innovation Challenge for ECTC 2026, the conference’s 76th anniversary. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount.
More than 2,000 scientists, engineers and businesspeople from more than 20 countries are expected to attend the 76th annual ECTC, which will take place May 26-29, 2026, at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL.
“This is a wonderful opportunity for students to have a platform to showcase innovative technical skills to packaging experts from industry and academia, through competition with other student teams from around the world,:said Przemyslaw Gromala, ECTC 2026 Vice General Chair and Sr. Expert & Simulation Team Leader at Robert Bosch GmbH. “The finalist student teams gain exposure to the conference’s state-of-the-art technical program and packaging experts; networking with potential employers, including potential internships; and will have the opportunity for their work to be published in the highly regarded technical journal, IEEE Transactions on Components, Packaging and Manufacturing Technology.”
The 2026 ECTC Executive Committee is inviting teams of up to three students – eligible participants should be currently enrolled in a undergraduate (BSc) / master’s (MSc) program, or doctoral (PhD) candidates from any university. Interested student teams must pre-register by December 31, 2025 for one of the following three pre-defined challenges, each one dealing with a critical aspect of simulation and reliability in electronic packaging.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
2026 IEEE Electronic Components and Technology Conference to Feature Keynote Address by ASE CEO Dr. Tien Wu
03/19/2026 | ECTCThe 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.