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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

Honeywell Unveils Satellite Antenna for Reliable BVLOS Drone Operations

08/21/2026 | Honeywell
Honeywell Aerospace announced the successful validation of a new satellite communications antenna designed to enable safe, reliable command-and-control of unmanned aircraft flying beyond visual line of sight (BVLOS).

£13M Boost for Next-Gen Satellite Communications for Trains and Farmers

08/21/2026 | UK Space Agency
More reliable broadband on remote Scottish railways and affordable sensors which help farmers grow more food are among a raft of new projects which will bring the benefits of space technology into everyday life.

SMTA Introduces New Academic Institution Membership

08/21/2026 | SMTA
The SMTA is introducing a new Academic Institution Membership designed to strengthen connections between academic institutions and the electronics manufacturing industry while helping prepare the next generation of industry professionals.

All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.
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