-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
PCB007 Magazine: November 2024—Engineering Economics
November 18, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The real cost to manufacture a PCB, often referred to as the "loaded cost," encompasses everything that goes into making that final circuit board product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality.
Sometimes called "Engineering Economics," there are many things one should be aware of to truly understand real costs. But of course, yield is everything in this business and building more accuracy into our boards as well as finding defects before too much cost is built into the boards is critical to a PCB fabricator’s success.
In the November 2024 issue of PCB007 Magazine, we examine the real cost of manufacture through several different lenses. Featured are Richard Koensgren of ICAPE, Matt Stevenson and Doug Palladino of ASC Sunstone, Dr. Pat Valentine of Uyemura, Happy Holden, and Dan Beaulieu.
Suggested Items
Northrop Grumman Launches Black Dagger Target to Test New Patriot Missile System Sensor
12/20/2024 | Northrop GrummanNorthrop Grumman Corporation launched a Zombie target vehicle variation, known as “Black Dagger,” from Fort Wingate to White Sands Missile Range, New Mexico, for the U.S. Army Space and Missile Defense Command’s (USASMDC) LTZ-3 test mission. Zombie targets get their name because they bring “new life” to demilitarized solid rocket motors by repurposing them to create threat-representative tactical ballistic missiles.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
Battery Prices Stabilize in November, Slight Increase Expected in 2025
12/12/2024 | TrendForceTrendForce’s latest research reveals that China's EV sales continued to grow throughout November 2024, driving demand for EV batteries. LFP battery prices remained stable, while prices for ternary batteries saw a slight decline.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.