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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort

09/01/2026 | Joe Fjelstad -- Column: Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From those pioneers, we have learned that the PCB is no longer simply the platform on which a design is manifested; it is now an active part of the electrical, thermal, mechanical, and economic architecture of the product. As operating frequencies rise, component pitches shrink, power densities increase, and product schedules tighten, decisions made by one discipline can no longer be isolated from the consequences they create for others.

THECA 2026 Review: Innovating PCBs and Advanced Electronics

08/31/2026 | Marcy LaRont, I-Connect007
The Thailand Printed Circuit Association hosted its third annual trade show in the bustling city of Bangkok this past week, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.” Building on its success as a leading PCB industry exhibition, THECA has brought together the entire PCB value chain, creating a comprehensive platform for advanced electronics.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2026 | Nolan Johnson, I-Connect007
This week, the Global Electronics Association published its monthly report on PCB fabrication and EMS bookings and shipments, and the numbers are extremely positive. In EMS, the three-month book-to-bill ratio stands at 1.29 for July. Year-to-date EMS bookings are at 11% over 2025. The picture is similar in PCB fabrication as well. Year-to-date bookings are up 33% over last year, and book-to-bill stands at 1.46.

PCBA Market Surges to $168.90 Billion at a CAGR of 5.1% by 2035

08/28/2026 | Globe Newswire
As per the SNS Insider, “The Printed Circuit Board Assembly Market size was worth USD 102.30 billion in 2025 and is projected to reach USD 168.90 billion by 2035, registering a CAGR of 5.1% from 2026 to 2035.”
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