Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Qnity Showcases Next-Generation Electronics Solutions at electronica 2026

11/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.

FSQuality in Thailand: From Automotive and Industrial Controls to AI and Optical Modules

11/05/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
One year after their first visit, the ECIO team returned to FSQuality Co., Ltd.’s Thailand factory to see what had changed over an eventful 12 months. The team was joined by Marcy LaRont following the THECA 2026 event in Bangkok. Having met with FSQuality Chairman Liu Tianming at the show the week before, we were eager to see firsthand how the company has evolved its customer strategy, expanded manufacturing to support AI and optical module applications, and added another new building to further increase its high-end manufacturing capabilities and strengthen Thailand’s growing PCB value chain.

I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.

AI Networking and Interconnect Market Projected to Reach US$279.8 Billion in 2027

11/02/2026 | TrendForce
TrendForce's latest AI infrastructure research indicates that the continued expansion of AI server clusters and surging accelerator bandwidth requirements are fueling rapid growth in the global AI networking and interconnect market.

ICEYE, Nokia Partner with Ukraine on Sovereign Satcom Capability

10/26/2026 | ICEYE
ICEYE, the European leader in sovereign intelligence from space, and Nokia, a global leader in connectivity infrastructure, today signed a Letter of Intent with The Ministry of Defence of Ukraine, to explore cooperation in space.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in