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Lam Research Expands Boise Investment to Support U.S. Chip Growth

02/18/2026 | PRNewswire
In a ribbon-cutting ceremony, Lam Research Corp. commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders.

Boyd Doubles Liquid Cooling Capacity in Mexico for AI and Data Centers

02/18/2026 | BUSINESS WIRE
Boyd is excited to announce its growing capacity for AI data center liquid cooling system production with the expansion of its design and manufacturing facility in Juarez, Mexico.

Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)

02/18/2026 | Marcy LaRont -- Column: Marcy's Musings
This month, I-Connect007 Magazine takes you inside the show, from exhibitors and special events on the show floor to new insights from the technical conference, details on apprenticeships, keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India about how they will be represented at APEX EXPO. It is a busy show that has a lot to offer attendees, and this issue will help ensure your time and attention are well spent.

Cut Through the Noise: I-Connect007 Previews APEX EXPO 2026 With ‘5 Things You Need to Know’

02/18/2026 | I-Connect007 Editorial Team
As APEX EXPO 2026 approaches, I-Connect007’s February magazines focus on exclusive pre-event coverage designed to cut through the noise and highlight the technologies and processes that engineers and manufacturers are actively evaluating today. Titled "The 5 Things You Need to Know About…”, this series brings together expert insights from leading companies across the electronics manufacturing ecosystem. Each contributor distills five essential takeaways within their area of expertise, providing readers with a practical preview of the technologies, processes, and strategic conversations shaping this year’s APEX EXPO.

Foxconn's NT$36 Billion Perpetual Syndicated Loan Deal is Signed

02/17/2026 | Hon Hai Precision Industry Co., Ltd.
Hon Hai Precision Industry Co., Ltd. (Foxconn), the world’s largest technology manufacturing platform service provider, completed the signing of a NT $ 36 billion “Sustainable Linkage Loan” on February 11 , 2026 , with Taiwan Bank acting as the co-organizer.
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