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Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec
January 8, 2026 | I-Connect007Estimated reading time: 1 minute
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
During the conversation, Buyea walks listeners through ceramic as a board substrate, outlining the ideal applications and technical advantages that make it well-suited for demanding environments. From thermal management and electrical performance to long-term reliability, he explains where ceramic excels—and how to determine when it is the right choice for a given design.
Buyea also shares customer stories that illustrate how Remtec’s manufacturing capabilities and engineering expertise translate into real-world success. With 35 years of experience in ceramic manufacturing and a staff of highly qualified engineers, Remtec emphasizes a deeply collaborative approach, working closely with customers to solve complex design and production challenges.
“This episode really highlights how material choice and collaboration go hand in hand,” said host Nolan Johnson. “Brian provides clear insight into where ceramic substrates shine and how Remtec partners with customers to make those solutions work.”
The episode is now available as part of the Voices of the Industry podcast series, featuring conversations with leaders across the electronics manufacturing ecosystem.
Listen to the episode here.
Learn more about I-Connect007 podcasts here.
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Murata Manufacturing Completes New Production Facility in Izumo
04/07/2026 | MurataIzumo Murata Manufacturing Co., Ltd., a manufacturing subsidiary of Murata Manufacturing Co., Ltd. located in Izumo City, Shimane Prefecture, has completed the construction of a new production building that had been under construction since March 2024.
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
03/17/2026 | Chandra Gupta -- Column: Below the SurfaceIn my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.
Powering the Future: How Packaging Choices Make or Break Performance
03/11/2026 | Brian Buyea -- Column: Powering the FutureWhen we talk about reliability in electronics, we often focus on the system level: redundancy, fail-safes, or software resilience. But long before the system is assembled or even tested, reliability is considered in materials, metallization, and the packaging process itself. If the foundation isn’t built to survive the environment, no amount of clever design downstream will make up for it.
Semiconductor Ceramic Packaging Market to Reach $2.78B by 2030, Growing at 8.5% CAGR
03/04/2026 | Globe NewswireThe semiconductor ceramic packaging materials market size is projected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, registering a CAGR of 8.5%.
Below the Surface: Ceramic Circuits—The Most Important Electronics You’ll Never See Working
02/25/2026 | Chandra Gupta -- Column: Below the SurfaceI decided to write this column to explain, plainly and honestly, how advanced packaging technologies work, and how they help engineers build better products. Ceramic circuits are a good place to start, because they remind us that the most important parts of great electronics are often the ones no one sees, until they’re gone.