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I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters.
Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
In his new column, Powering the Future, Brian takes readers inside that battle. Drawing on decades of experience in advanced materials and packaging, he’ll explore the technologies that make high-power electronics possible, from metalized ceramics and thick film circuits to advanced substrates and thermal interface materials.
Each month, Brian will explore how innovations in materials science—particularly in aluminum nitride, alumina, and metallized ceramics—are transforming power management, enabling higher efficiency, improved heat dissipation, and smaller, more reliable systems. He’ll look at the details of thermal design, thick-film metallization, and substrate engineering, showing how these hidden layers determine everything from device lifespan to performance at scale.
Whether it’s the next generation of EV inverters, high-frequency RF amplifiers, or medical laser drivers, Powering the Future will show how smarter material choices and better heat control are more than technical improvements; they’re competitive advantages.
Brian will write about the intersection of physics and innovation, where ceramics, films, and substrates become the building blocks of the technologies that will drive the next decade.
Look for Brian's new column to debut next week!
