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APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
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Where Electronics Manufacturing Turns for Trusted Technical Insight
January 12, 2026 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
The Resource Center was built with engineers, manufacturers, and decision-makers in mind, and reflects I-Connect007’s long-standing commitment to education, technical rigor, and practical relevance across the electronics manufacturing ecosystem.
The whitepapers featured in the Industry Resource Center span the full electronics lifecycle, covering topics from advanced packaging and board-level integration to materials selection, reliability, and sustainability. These resources have been commissioned by the leading voices in the industry, including the Global Electronics Association, MacDermid Alpha Electronics Solutions, NCAB Group, Taiyo Uden, and more. Together, they offer perspectives grounded in real-world manufacturing and design experience, providing readers with insight they can apply directly to current and future programs.
A recurring theme throughout the collection is the growing complexity of modern electronic systems and the need for tighter integration across traditionally separate disciplines. These papers focus on practical considerations such as material compatibility, reliability risk, and the increasing interdependence between design intent and manufacturing capability, underscoring why early cross-disciplinary alignment is becoming critical as products move toward next-generation integration strategies.
Sustainability is one prominent focus within the Resource Center, particularly in whitepapers commissioned by the Global Electronics Association. The content explores how environmental goals intersect with cost, reliability, compliance, and long-term product performance, helping manufacturers to understand where sustainability initiatives have a tangible impact on both engineering and business.
Material selection and protection strategies are also explored in depth, with guidance contributed by industry suppliers such as MacDermid Alpha Electronics Solutions, and cover topics like conformal coatings and protective materials. These technical insights highlight the downstream effects of early material decisions on yield, process control, and long-term reliability, reinforcing the importance of informed choices early in the design cycle.
The whitepapers in I-Connect007’s Industry Resource Center emphasize informed, application-driven decision-making. By bringing together perspectives from industry associations and technology suppliers alike, the Resource Center provides readers with a well-rounded view of the technical forces shaping today’s electronics industry and the insights needed to navigate them with confidence.
Through opportunities like the Industry Resource Center, I-Connect007 continues to expand its role as an educational partner to the global electronics community, helping professionals stay informed, aligned, and prepared for what comes next.
Connect to the Industry Resource Center here.
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Sweeney Ng - CEE PCBSuggested Items
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
EMS Leadership Summit: A Smarter Way to Gather EMS Leaders
02/11/2026 | Nolan Johnson, SMT007 MagazineMark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Global Chips Market Hitting Record High Sales Figures in 2025
02/09/2026 | ESIAThe European Semiconductors Industry Association (ESIA) announced that global semiconductor sales reached US$ 791.69 billion in 2025, which means a marked 26.1% increase on a year-on-year basis. Semiconductor sales in the Europe reached US$ 54.46 billion in 2025, a 6.2% rise versus 2024.