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Sweeney Ng - CEE PCB

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EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec

02/12/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.

EMS Leadership Summit: A Smarter Way to Gather EMS Leaders

02/11/2026 | Nolan Johnson, SMT007 Magazine
Mark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.

EIPC Winter Conference 2026 Review: The Keynote Sessions

02/11/2026 | Pete Starkey, I-Connect007
Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.

Global Chips Market Hitting Record High Sales Figures in 2025

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