Fresh PCB Concepts: The Importance of Bare Board Testing for Reliability
Elementary, Mr. Watson: Design Intent Over Design Speed
Beyond Design: Managing Linear Workflow Bottlenecks
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
January 14, 2026 | I-Connect007Estimated reading time: 1 minute
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
In “Designer’s Notebook: Heterogeneous Interposer Design Challenge, Part 1,” longtime consultant Vern Solberg explores how the evolution of monolithic system-on-chip designs has enabled increasingly complex heterogeneous systems. In his two-part series, Solberg explains that multiple active elements are integrated within a single silicon platform, and new design, materials, and manufacturing considerations emerge.
Next, “Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia” reports from the Advanced Electronic Packaging Workshop held in Penang. Authored by technical solutions leaders from the Global Electronics Association, the article highlights why advanced packaging is central to Malaysia’s semiconductor ambitions and underscores the need for standards development, workforce alignment, and stronger ecosystem collaboration at a pivotal moment for the region.
Rounding out the issue, “A Glimpse Into the Future of IC Substrates and Beyond” offers a global perspective from Edy Yu, Editor in Chief of ECIO, who draws on insights from a major symposium hosted by the Hong Kong Printed Circuit Association and the Korea Printed Circuit Association, with support from SEMI. The review covers emerging developments in glass substrates, AI and HPC packaging, warpage control, heterogeneous co-design, and SiC power semiconductor technologies.
Together, these features offer a multidimensional perspective on the technical, organizational, and global forces shaping advanced electronic packaging today. For insight into the challenges and opportunities defining the next phase of the industry, son’t miss the Jan. 19 issue of Advanced Electronics Packaging Digest.
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