Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™.

KYZEN's Chelsea Jewell to Present on Pre-Immersion Cleaning Chemistries at OCP Global Summit 2026

10/09/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, KYZEN Application Lab Manager, will present as part of the Open Compute Project (OCP) Global Summit scheduled to take place from October 12-15, 2026, at the San Jose Convention Center in San Jose, California.

KYZEN Wins Cleaning Materials Award at SMTA Guadalajara 2026

10/08/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its MICRONOX® MX2123 cleaning chemistry has won a 2026 Mexico Technology Award in the Cleaning Materials category.

3 Key Takeaways: Making ENIG and ENEPIG More Sustainable

09/30/2026 | I-Connect007
Gold prices have risen dramatically over the past decade, putting additional pressure on PCB fabricators to control costs without compromising the finishes their customers require. For ENIG and ENEPIG processes, however, the opportunity to reduce costs may also present an opportunity to improve sustainability. In its white paper, “Can ENIG & ENEPIG Process be Sustainable?” MacDermid Alpha Electronics Solutions provides guidelines for where the greatest opportunities exist to reduce gold consumption, chemistry use, energy demand, and waste while continuing to meet established performance requirements.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in