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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

The Chemical Connection: When History Repeats Itself on Diversification

08/04/2026 | Don Ball -- Column: The Chemical Connection
Diversification, as a way to spread out risks, maintain steady cash flows, and sustain stable earnings in unpredictable business environments, is a concept that has long been used by all businesses, not just PCB fabrication. Is it really a sound business approach? With the benefit of 20/20 hindsight afforded by over 50 years of experience in the PC fab business, I have formed some definite opinions and observations on this subject, which I will now share with you (with some caveats).

Balancing Performance, Cost, and Reliability When Selecting a Cleaning Machine

06/24/2026 | Vladimir Sitko, PBT Works
Even the most advanced cleaning chemistry requires an effective delivery system, so selecting the appropriate cleaning machine is crucial. Cleaning equipment must do far more than simply wash boards. As assemblies move toward lower standoff heights, finer pitches, and increasingly complex geometries, the equipment must deliver chemistry into confined spaces, reliably remove contamination, rinse thoroughly, and dry completely, all while balancing throughput, operating costs, and long-term reliability requirements.

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.
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