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Indium to Reinforce Its Leadership in Ag and Cu Pressure Sinter Solutions at NEPCON Japan 2026
January 15, 2026 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation® will feature its highly versatile InFORCE® series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo.
The company will showcase the following among its featured products:
InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE®MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
To learn more about sinter solutions, visit the Indium Corporation website, and connect with our experts at NEPCON Japan 2026, booth #E1-36.
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