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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IMAPS Enhances IMAPS Academy

08/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS), the leading organization dedicated to advancing microelectronics and electronics packaging, is pleased to announce the updated IMAPS Academy—an enhanced online training platform designed to address the industry's growing workforce development needs.

What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.

YINCAE Showcases High-Performance Materials at IMAPS 2025

09/03/2025 | YINCAE
YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 - October 1.

IIM Calcutta Launches Advanced Programme in Smart Manufacturing Leadership to Drive India's Industry 4.0 Revolution

08/13/2025 | PRNewswire
As India advances towards its goal of becoming a USD 5 trillion economy, the government is focused on enhancing the manufacturing sector, particularly through smart and digital manufacturing initiatives.

Meet the Author Podcast: Beth Turner Explores Encapsulating Sustainability for Electronics

07/28/2025 | I-Connect007
In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
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