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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Volker Klafki Joins Ventec as Senior Technical Engineer for EMEA
February 4, 2026 | VentecEstimated reading time: 1 minute
Ventec International Group is delighted to announce the appointment of Volker Klafki as Senior Technical Engineer for EMEA.
With over 30 years of experience in PCB manufacturing and the distribution of base materials, Volker has acquired a wealth of experience, which he has successfully applied to customer consulting. In his management position in technical consulting, he is a highly regarded contact for base material processing, quality issues, UL approvals and technical presentations.
Mels Wolters, Director of Operations EMEA & Americas, comments, “Volker’s appointment is part of our strategy to expand our wide range of product offerings within the PCB market, supporting and working closely with our customers to provide complete solutions. We welcome Volker to the Ventec team and wish him success in his new role.”
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Macnica ATD Europe Acquires Indesmatech to Deepen Engineering Presence Across Northern Europe
05/11/2026 | BUSINESS WIREMacnica ATD Europe announced the acquisition of Indesmatech, a pan-European technology and advisory company specializing in advanced semiconductor representation, design-in support and consulting, as well as point click buying services.
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
STI Electronics Announces New Recipients of the Jim D. Raby/STI Scholarship
04/22/2026 | STI Electronics Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, is proud to announce the latest recipients of the Jim D. Raby/STI Scholarship: Ashley Brito, Process Control Technology; June-Ann C. Richards-Owens, Advanced Manufacturing; and Jayden Deon Jones.
Technica Announces Tech Day Event Dates and Agenda
04/13/2026 | Technica USATechnica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.