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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications. The new formulation, PCMPSolv™ PCMP2310 clean, is engineered to support advanced semiconductor manufacturing while enhancing sustainability across fab operations.
“As semiconductor devices continue to shrink and architectures become more complex, our customers require solutions that push the boundaries of innovation,” said Randal King, Chief Technology and Sustainability Officer at Qnity. “Qnity’s newest PCMPSolv™ solution helps fabs achieve the ultra-clean wafer surfaces essential for advanced-node performance. We’re proud to be powering today’s most advanced PCMP cleaning while promoting sustainability through operational efficiency.”
About PCMPSolv™ PCMP2310 PCMP clean
PCMPSolv™ PCMP2310 introduces a new standard for ceria PCMP cleaning by integrating the cleaning process directly inside the CMP tool. This in situ approach eliminates the need for traditional ex situ sulfuric acid peroxide mixture (SPM) steps, simplifying process flows and improving operational efficiency.
The solution provides strong removal of ceria and organic residues to support more consistent electrical performance across critical layers, lowers defectivity in one of the most challenging areas of ceria-based CMP at advanced nodes, and minimizes oxide loss to protect the increasingly delicate film layers used in next generation device architectures.
PCMPSolv™ PCMP2310 also delivers sustainability and manufacturing benefits. By eliminating hazardous SPM-based processes, it reduces chemical waste and lowers CO₂ emissions. Its integrated in situ cleaning approach decreases tool environmental footprint, streamlines fab operations, and improves cost of ownership—without compromising quality or reliability.
