Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3
Elementary, Mr. Watson: APEX EXPO—The Ghosts of Past, Present, and Future
Beyond Design: Demystifying Common‑Mode Radiation
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
February 11, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging.
As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
Anaya Varda, president of American Standard Circuits, explores this convergence in “Foundations and Drivers of the PCB Flex–Advanced Packaging Nexus, Part 1,” examining how flexible PCBs and advanced semiconductor packaging are evolving together to support higher density, smaller form factors, and greater functional integration. The article outlines the technical foundations behind this shift and the forces accelerating closer coordination across design and manufacturing.
In “APEX EXPO 2026 Tech Conference: Changing the Electronics Systems Conversation,” Matt Kelly, CTO of the Global Electronics Association, and Devan Iyer, chief strategist for advanced packaging, discuss how the APEX EXPO 2026 Technical Conference reflects a broader industry move toward a “silicon-to-systems” perspective. Drawing on insights from recent global workshops and technical sessions, the article highlights how the conference brings component-level and system-level experts together to address emerging challenges across advanced electronics packaging.
Technical consultant Vern Solberg continues his examination of heterogeneous integration in “Heterogeneous Interposer Design Challenge, Part 2,” building on the industry’s evolution from monolithic system-on-chip designs to complex architectures that integrate processing, memory, sensing, and communication functions across advanced substrates and interposers.
Published by I-Connect007, Advanced Electronics Packaging Digest delivers expert-driven coverage of the technologies, standards, and strategic considerations shaping advanced electronics packaging and system integration. The February issue will be delivered to subscribers on Monday, Feb. 16. To subscribe, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMI Europe Recognizes Tyndall and imec for Their Contributions to the Semiconductor Industry
03/13/2026 | SEMISEMI Europe announced the winners of the SEMI European Award 2025 and Special Service Award at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2026 in Sopot, Poland.
BTU International Names SMarTsol America as Representative for Texas Territory
03/13/2026 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that SMarTsol America will represent the company in Texas, effective January 15, 2026.
Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute
03/15/2026 | Marcy LaRont, I-Connect007The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.
Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.
03/11/2026 | Ventec International GroupVentec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.