RBB Systems Boosts Manufacturing Capabilities with Equipment Upgrades for 2026

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RBB, a trusted leader in electronics manufacturing since 1973, is starting the new year with significant equipment upgrades designed to enhance precision, throughput, and manufacturing capabilities across its production lines.

To support its commitment to quality and efficiency, RBB has installed MPM MOMENTUM II 100 stencil printers on both SMT lines, offering industry-leading alignment repeatability, wet print accuracy, and dual-lane processing capabilities—all in a compact, space-saving design. Key features of the Momentum II 100 include:

• AccuCheck Print Capability Verification for real-time assurance of print quality
• Automatic Paste Dispensing System for precise, uniform paste application
• BridgeVision and StencilVision for advanced inspection of PCB and stencil surfaces
• EdgeLoc Board Clamping System ensuring consistent board flatness and optimal gasketing
• High Flow Venturi with Closed-loop Control for consistent quality and easy setup
• OpenApps Architecture supporting custom Industry 4.0 integration

Additionally, RBB has expanded its measurement and profiling capabilities with the addition of ASC International LineMaster Fusion 3D inline solder paste measurement and M.O.L.E. EV6 thermal profilers for both reflow oven and wave solder processes. These systems provide fast, accurate, and automated data collection, helping RBB maintain repeatable quality with minimal operator intervention.

To further improve production efficiency, RBB added a new depanelization machine, a slideline with integrated monitoring, and advanced through-hole preparation equipment, enabling higher throughput and better control of mixed-technology assemblies.

To improve environmental control on the factory floor, RBB implemented a new industrial dry fog humidification system from IKEUCHI. This system uses ultra-fine “Dry Fog” technology to maintain stable relative humidity without wetting sensitive surfaces or equipment. By distributing very fine droplets with a mean diameter of 10 µm or less, the system helps suppress electrostatic discharge (ESD) issues, reduce debris and dust adhesion, and improve overall process stability during sensitive assembly and handling operations. Designed for industrial spaces, the humidification system achieves humidity control with energy use significantly lower than traditional steam humidifiers while also providing slight evaporative cooling and reducing static-related defects in electronics manufacturing environments.

In addition to these upgrades, RBB added a new MR2 Router depanelization system, bringing high-precision PCB routing capability in-house. Built on heavy-duty machine tool construction, the MR2 Router features a solid 2-inch-thick precision-ground steel base that enables ±0.0005-inch cutting accuracy at high speeds. An overhead gantry with precision THK ball screws and closed-loop servo drives supports a full range of cut types — lines, arcs, angles, and 3D topography — while a dual vacuum configuration delivers exceptional debris removal and clean depanelization results.

“These upgrades significantly enhance our capabilities and allow us to deliver higher precision and efficiency for our customers,” said Bruce Hendrick, Owner and CEO, RBB. “We continue to invest in new equipment to ensure reliable, high-quality electronic assemblies for prototypes.”

RBB specializes in turnkey and consignment manufacturing, including both surface mount and through-hole assembly, with expertise in mixed-technology designs commonly used in avionics, communications, power, and control systems.