Dr. Jennie Hwang to Deliver PDCs on AI and High Reliability at APEX EXPO 2026

Estimated reading time: 3 minutes

Dr. Jennie Hwang, chair of the AI Committee of the National Academies/DoD AI study, chair of the National AI Institute of NSF, and chair of the Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and integrated insights to her AI course, “Artificial Intelligence and AI-Powered Electronics Manufacturing” at APEX EXPO 2026 on Sunday, March 15. Her leadership at the intersection of national policy, research strategy, and technological innovation provides participants with a comprehensive and forward-looking perspective on AI.

Dr. Hwang will teach a second course, “High Reliability Electronics for Harsh Environments,” earlier that day.

A pioneer and long-standing leader in SMT manufacturing and lead-free implementation, Dr. Hwang brings deep knowledge and broad experience to the high-reliability electronics course. Her work spans both hands-on and advisory roles across commercial military applications. Her comprehensive and discerning approach has addressed some of the toughest reliability and production issues for Class 3 and mission-critical and safety-centric electronics.

Together, these courses offer practical working knowledge and pragmatic perspectives for professionals concerned with product reliability in harsh environments, as well as those seeking a holistic understanding of the present and future landscape of AI and AI in electronics manufacturing.

Sunday, March 15 – 1:30 PM -4:30 PM
PD12 "Artificial Intelligence & AI-Powered Electronics Manufacturing"

Are you AI-ready? Given the transformative power of Artificial Intelligence, special emphasis will be placed on AI-powered electronics/microelectronics manufacturing. Whether you’re just starting out or already experienced, this course has something for you: a strong starting point for novices and innovative perspectives for experts.

This course delivers an up-to-date and holistic overview – organized systematically and hierarchically – with a panoramic perspective on how to harness AI to boost on-the-job efficiency, drive effectiveness, and accelerate enterprise growth, and a highlight of what it takes to build AI systems worthy of trust and justified confidence. Enriched with real-world use cases, practical tips, and actionable recommendations, the session will outline the key components underpinning AI technologies, including: Machine Learning (ML), Deep Learning (DL), Neural Networks (NN), Internet of Things (IoT), Digital Twins, Large Language Models (LLMs), Small Language Models (SLMs), Edge AI, data quality and management, Generative AI, and AI Agent and Agentic AI.

Practical applications will be illustrated across core manufacturing functions such as quality assurance, inspection, process optimization, preventive maintenance, and supply chain management.

Participants will also gain a working knowledge of prompt engineering for LLMs, learning techniques to maximize their value.  The session further examines AI’s evolving impact on engineering jobs and related professions, and offers insights into Artificial General Intelligence vis-à-vis the human brain and mind. It concludes by shedding light on the potential trajectories of AI and the nuanced perspectives shaping its future.

No prerequisites are required - join us to stay in the core knowledge zone, unlock AI’s power in electronics manufacturing and beyond, and gain practical insights, real-world use cases, and proven tips to put AI to work - walk away equipped to apply AI with clarity, confidence, and impact.

Sunday, March 15 – 9:00AM – 12:00 PM
PD-05 “High Reliability Electronics for Harsh Environments”

“When Environments Get Harsh, Reliability Gets Critical.” The electronics/microelectronics industry increasingly demands high-reliability products capable of consistently performing under harsh conditions. This course dissects what it takes to achieve such performance – examining the underlying rationale, identifying the most critical and discerning factors, and offering ten (10) imperatives to ensure product reliability under harsh environments.

Key players in the reliability of PCB assembly - including components, PCB, solder joints, and manufacturing processes - will be addressed. The causes and prevention of likely product failure categories and failures induced by time, voltage, and external environments, such as intermetallic compounds, electro-migration, creep corrosion, and tin whiskers, will be highlighted. Backward compatibility of Pb-free BGA solder-ball and SnPb solder paste, the heightened impact of solder joint voids, and the relative ranking among solder alloy systems, including new “low-temperature-solder,” will be summarized.

Designed to equip manufacturers with a holistic framework for building robust products, the course integrates test data, real-world performance insights, and core scientific, engineering, and manufacturing principles to proactively address both known and likely failure modes. Attendees are welcome to bring their own selected systems for deliberation.