Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
Target Condition: An Exploration of Flooding PCB Layers
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
February 17, 2026 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona.
The session, The Impact of Time, Pressure, Thickness, and Patterning on Compressible Metal Thermal Interface Materials, will examine how key design and process variables drive the thermal performance benefits of compressible metal thermal interface materials (TIMs). The findings reflect the collaborative research conducted by Burt and Indium Corporation colleagues Bob Jarrett, Miloš Lazić, Ryan Mayberry, Ricky McDonough, and Emin Skiljan.
“Our team explored how time, pressure, thickness, and patterning influence effective thermal resistance and bondline thickness (BLT), and how optimizing these parameters can improve heat transfer efficiency and reliability,” Burt said. “The talk will illustrate how the team’s use of the ASTM D5470 test method revealed relationships between each variable and provided actionable insights for maximizing thermal performance in demanding TIMs applications.”
In his role as a Technical Support Engineer, Burt provides specialized assistance to optimize the selection and use of Indium Corporation materials and delivers product and process training. He earned a bachelor’s degree in chemistry from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
TestConX 2026 attendees can join the presentation on Wednesday, March 4, 10:30 a.m. MST. For more information on Indium Corporation’s Compressible TIMs products, visit the Indium Corporation experts at show booth #46.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Double Win: Indium Corporation’s CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
04/07/2026 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder paste products.
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
04/06/2026 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a long-term offtake framework agreement with Flash Metals USA Inc., a wholly owned subsidiary of Metallium Limited (MTM), for the supply of critical metals recovered using Metallium’s Flash Joule Heating technology.
Indium Corporation to Highlight High-Reliability Solder Solutions for EV and Mobile at Productronica India
04/01/2026 | Indium CorporationAs a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation® will showcase its advanced Rel-ion® products at Productronica India, April 8-10, in Greater Noida, India.
Driving Yield and Reliability: Indium to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
03/20/2026 | Indium CorporationIndium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China.