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New IPC Standards Released
February 23, 2026 | Global Electronics AssociationEstimated reading time: 3 minutes
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards.
These are the latest releases for Q1 2026.
IPC-2591 V2.0, Connected Factory Exchange (CFX)
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies—automated, semiautomated, and manual—and is applicable to related mechanical assembly and transactional processes. This Connected Factory Exchange (CFX) standard provides a true ‘‘plug and play’’ Internet of Things (IoT) communication environment throughout manufacturing, where all equipment, manufacturing processes, and transactional stations can communicate with each other without the need for the development and use of bespoke interfaces. CFX-enabled equipment and solutions from different vendors work seamlessly together.
IPC-7530B, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective, and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects that can be attributed to profiling.
IPC-4556A, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Boards
This performance specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards. This performance specification defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS), and original equipment manufacturers (OEMs).
This standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 series (IPC-6012, IPC-6013, and IPC-6018) of standards.
The ENEPIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification. This specification is based on three critical factors:
- The ENEPIG plating process is in control, producing a normal distribution for nickel, palladium, and gold deposit thickness.
- That the tool used to measure deposit thickness, and therefore control the process, is accurate and reproducible for the thickness ranges specified.
- That the ENEPIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined herein.
IPC/WHMA-A-620F, Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC-T-50P, Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire harnesses, board packaging, sintered interconnects, soldering, fabrication processes, and testing.
IPC-9271, Guidelines for In System Programming
IPC-9271 provides guidelines for device-level In-System Programming (ISP) as part of the electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer, and the integration of the programmer in the production environment, including fixtures, software, mechanical, and process integration methodologies to increase efficiency, which reduces programming costs and improves productivity and quality in the production environment.
This article originally appeared in the January 2026 issue of I-Connect007 Magazine.
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