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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

Ionic Contamination Debate Highlights Growing Divide in Automotive Electronics

07/15/2026 | I-Connect007 Editorial Team
A recent Global Electronics Association panel discussion revealed both broad agreement and sharp differences regarding one of electronics manufacturing’s most persistent reliability questions: How clean is clean enough? The discussion, focused on ionic contamination assessment in electronic control unit (ECU) manufacturing, brought together the following experts:  Tim Dietz from Ford Motor Company, Dr. Lothar Henneken from Robert Bosch, Eric Camden from Foresite, Hubertus Mertens from MKS’ Atotech, Doug Pauls from It Depends Electronics, and Stan Rak from SF Rak Company, as moderator. While everyone agreed that contamination control is essential for long-term reliability, panelists differed significantly on whether ion chromatography (IC) should play a larger role in production acceptance and process control.

Nolan’s Notes: Cleaning With Smaller Geometries

06/03/2026 | Nolan Johnson -- Column: Nolan's Notes
Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

05/04/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

AI, HDI, and Interconnect Optimization with MKS' ESI

04/23/2026 | Real Time with... APEX EXPO
This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.
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