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Cadence Accelerates Digital Twin–Driven Data Center AI Modernization with HPE

06/17/2026 | Cadence Design Systems
Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.

Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA

06/01/2026 | Cadence Design Systems
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Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

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Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.

Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

05/11/2026 | Cadence Design Systems
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications.
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