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Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly
February 25, 2026 | Real Time with... APEX EXPOEstimated reading time: 1 minute
Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.
Experts will be present in Remtec's booth, #4429, to discuss these capabilities.
Look for more interviews with industry experts leading up to APEX EXPO 2026, special show coverage after the event on the Real Time with... APEX EXPO 2026 website and in our new Show & Tell Newsletter, sent to your inbox on Fridays starting March 27.
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