-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Technology Pavilion Debuts at APEX EXPO 2026
February 26, 2026 | Global Electronics AssociationEstimated reading time: 1 minute
Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles.
“The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees,” said Chris Jorgensen, senior director, next-generation standards, Global Electronics Association.
This is more than just a product showcase, he said. “The Pavilion is there to spark insight, challenge assumptions, and help attendees connect emerging capabilities to real-world manufacturing and design challenges they face today.”
The Pavilion will be the site for the Design Town Hall, which recognizes progress in design standards, education, events, and new solutions as well as a panel discussion with the IPC Design Leadership Council.
“You can expect to come away from the Technology Pavilion with a clearer understanding of where advanced PCB and PCBA technologies are heading,” Jorgensen says, “how digital manufacturing, leading-edge materials sciences and multiphysics simulation are enabling more complex designs, and how connected design workflows are reducing risk across the product lifecycle.”
To continue reading this article, which originally appeared in the February editons of SMT007 Magazine and I-Connect007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
DesignCon 2026: From Copper to Quantum to Agentic AI
02/26/2026 | Kelly Dack, I-Connect007Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale
02/25/2026 | BUSINESS WIREVinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.
DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
02/24/2026 | GlobeNewswireDesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the 2026 edition.
Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
02/24/2026 | BUSINESS WIREBaya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company.