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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Technology Pavilion Debuts at APEX EXPO 2026
February 26, 2026 | Global Electronics AssociationEstimated reading time: 1 minute
Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles.
“The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees,” said Chris Jorgensen, senior director, next-generation standards, Global Electronics Association.
This is more than just a product showcase, he said. “The Pavilion is there to spark insight, challenge assumptions, and help attendees connect emerging capabilities to real-world manufacturing and design challenges they face today.”
The Pavilion will be the site for the Design Town Hall, which recognizes progress in design standards, education, events, and new solutions as well as a panel discussion with the IPC Design Leadership Council.
“You can expect to come away from the Technology Pavilion with a clearer understanding of where advanced PCB and PCBA technologies are heading,” Jorgensen says, “how digital manufacturing, leading-edge materials sciences and multiphysics simulation are enabling more complex designs, and how connected design workflows are reducing risk across the product lifecycle.”
To continue reading this article, which originally appeared in the February editons of SMT007 Magazine and I-Connect007 Magazine, click here.
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.