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03/15/2026 | Marcy LaRont, I-Connect007
The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.

HyperLight, UMC & Wavetek Partner for TFLN Chiplet™ Foundry Production

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HyperLight Corporation, United Microelectronics Corporation, and Wavetek Microelectronics Corporation, a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both 6-inch and 8-inch wafers.

India Advances Toward 85,000 Semiconductor Engineers Under C2S

03/12/2026 | PIB Delhi
Government of India’s initiative for prioritizing talent development through Training, Up-skilling and Workforce Development Programs under Chips to Startups (C2S) initiative of India Semiconductor Mission (ISM), Union Minister for Railways, Information & Broadcasting, and Electronics & IT, Ashwini Vaishnaw, stated that India has made significant progress in last 04 years itself for its 10-year target of training 85,000 engineers in semiconductor design.

Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.

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Ventec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.

Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3

03/16/2026 | Vern Solberg -- Column: Designer's Notebook
In just about any industry, time-to-market will establish the difference between the leaders and followers. Any new electronic product introduced into the market must meet or exceed stated performance criteria and provide reliable service to the end user experience. The original single-core monolithic system-on-chip developed for the earlier, less complex applications has long been superseded by the more sophisticated multiple-core variations.
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