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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Future Electronics, SnapMagic Announce CAD Model Integration to Support Faster Design Cycles
March 4, 2026 | SnapMagicEstimated reading time: 1 minute
Future Electronics, a leading global distributor of electronic components, and SnapMagic, a provider of CAD models and design enablement tools for electronic components, have announced the launch of integrated SnapMagic CAD models across the Future Electronics global online catalog. Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
The new integration brings over ten million CAD assets into the Future Electronics digital experience, allowing engineers to download models in formats compatible with leading ECAD tools without leaving the website. Each model is aligned with manufacturer specifications to support accuracy and consistency throughout early design stages.
“Providing engineers with immediate access to reliable CAD resources reinforces our commitment to supporting customers throughout the entire design journey,” said Georgia Genovezos, Corporate Vice President of Digital Marketing at Future Electronics. “By working closely with SnapMagic, we are delivering a seamless experience that connects component selection with practical design execution.”
SnapMagic brings its extensive CAD library and model generation expertise to the collaboration, expanding access to high quality design assets for engineers worldwide.
“Our goal is to remove friction from the design process by making CAD models easy to find and easy to use,” said Natasha Baker, CEO at SnapMagic. “Partnering with Future Electronics allows SnapMagic to support engineers as they are selecting components - without needing to change their existing workflows.”
This joint launch represents a shared focus on design enablement and reflects both companies’ continued investment in tools that help engineering teams move faster and design with confidence.
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Rachael Temple - AlltematedSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp
04/21/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.
FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
04/20/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
DARPA Launches HARQ Program to Integrate Diverse Qubits for Scalable Quantum Computing
04/20/2026 | DARPADARPA has launched the Heterogeneous Architectures for Quantum (HARQ) program, an effort aimed at overcoming one of the most persistent barriers in quantum computing: how to move beyond single-technology systems to achieve and scale practical, high-impact applications.