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I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics.
In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
Subject matter expert Drew Delaney provides a firsthand look at the advanced materials science powering everything from hyperscale AI data centers to 5G antennas and rugged edge devices. From ultra-low-loss laminates measured in thousandths of a decimal point to PCBs engineered to withstand liquid cooling, desert heat, and years of maintenance-free operation, Delaney explains the material properties required to thrive in an era racing toward performance beyond 400G.
Marcy LaRont of I-Connect007 hosts the series, offering listeners a practical, engineering-focused perspective on why laminate selection remains one of the most consequential early decisions in any PCB build—often determining success or failure long before fabrication begins.
“Material selection isn’t just a specification exercise—it’s a strategic design decision,” said Marcy LaRont, host of the series. “As AI, 5G, and high-speed applications continue to push performance boundaries, engineers must think beyond traditional materials and consider long-term reliability, thermal demands, and, of course, signal integrity. This series helps demystify those choices and highlights why they matter more than ever.”
The six-part series will continue with episodes addressing other critical topics shaping today’s PCB fabrication and manufacturing landscape.
Listeners can access the episode on I-Connect007’s podcast platform, as well as on Spotify and Apple Podcasts.
