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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Peters Opens Sales Office for Southwest Europe

06/11/2026 | Peters
Peters has strengthened its presence in Southwest Europe this spring. With the opening of a sales office in France, the Lower Rhine-based company aims to boost its collaboration with business partners across the Southwest European region.

Technica USA Joins Supply Partner Agfa at TechBlick 2026

06/11/2026 | Technica USA
Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.

ICAPE Welcomes New Institutional Investor After 1.85% Stake Sale by Thierry Ballenghien

06/11/2026 | ICAPE Group
ICAPE Group announces that the Farringdon European Opportunities fund has acquired a stake in its capital.

Ventec Giga Named Worldwide Exclusive Distributor for Elinta Robotics

06/10/2026 | Ventec International Group
We are proud to announce that Ventec Giga has been appointed as the worldwide exclusive distribution partner for Elinta Robotics — a leading manufacturer of advanced automation equipment.

HyRel Offers Component Taping and Packaging Services

06/09/2026 | HyRel Technologies
HyRel™ Technologies, a global provider of high quality, quick turn semiconductor modification solutions, announces the availability of Component Taping and Packaging Services for PCBA assemblers.
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