Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
Target Condition: An Exploration of Flooding PCB Layers
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
Henger to Showcase AI‑Era Plasma Solutions at APEX EXPO 2026
March 11, 2026 | HengerEstimated reading time: Less than a minute
Henger is a leading developer of advanced plasma treatment systems for high‑speed, high‑density PCB manufacturing, serving global customers in AI servers, HDI, and advanced packaging. Henger will be exhibiting at APEX EXPO 2026 to present its latest plasma treatment solutions designed for the AI‑driven generation of high‑speed, high‑density PCB manufacturing. As AI servers push PCB designs toward ultra‑high layer counts, advanced materials, and tighter reliability requirements, Henger’s plasma systems provide the precision, uniformity, and process adaptability needed to support next‑generation production.
At this year’s show, Henger will highlight its high‑density plasma technology, optimized for deep‑aspect‑ratio microvias, advanced HDI structures, and emerging materials such as M9‑grade low‑Dk laminates. The company’s systems feature intelligent parameter control, multi‑gas process flexibility, and enhanced energy efficiency — enabling PCB manufacturers to improve adhesion, reduce drilling defects, and achieve higher yields in AI‑era applications.
Henger welcomes visitors to Booth #4647 at APEX EXPO 2026 to learn more about its customized plasma solutions for AI servers, high‑speed digital boards, and advanced packaging substrates.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.