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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next

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I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part On the Line With… Qnity podcast series exploring the materials, technologies, and engineering challenges shaping the future of electronics. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.

Kratos, Airbus Complete First European Flight of U740 Valkyrie CCA

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Army Assessment Validates Trust Automation’s SUADS in Combat Training

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GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging

10/12/2026 | GlobalFoundries
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Global Electronics Association, Purdue University Establish Strategic Partnership to Advance Electronics Innovation

10/09/2026 | Global Electronics Association
The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.
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