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Advanced Electronics Packaging Digest

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Itera Exits Stealth with $12M to Bring Real-Time Prototyping to Electronics

05/27/2026 | BUSINESS WIRE
Deep tech startup Itera emerged from stealth with a prototype of the world’s first fluid circuit board, enabling engineers to test and modify electronic designs using real components in real time.

TopLine to Exhibit CCGA Solutions at Space Tech Expo

05/22/2026 | TopLine
TopLine Corporation will exhibit its innovative electronic component solutions and solder column technology in booth #539 at the upcoming Space Tech Expo USA show at the Anaheim Convention Center, Anaheim, California, June 3 – 4, 2026.

Amca Closes $300M Series B at $1B+ Valuation to Strengthen America's Critical Component Supply Chain

05/21/2026 | PRNewswire
At a time of growing geopolitical instability and mounting strain on the legacy industrial base, America needs a faster and more resilient way to engineer, qualify, and manufacture critical defense and aviation components.

FKN Systek K4000: Depaneling V-Scored PCBs with Overhanging Components

05/19/2026 | FKN Systek
FKN Systek introduces the K4000 PCB depanelizer. Custom EDM slots on a K4000 Linear blade enhance the depaneling process, providing space to clear the cutting path for parts overhanging the score line of a panelized PCB, thus enabling the separation of skip-scored PCB panels with overhanging components.

BAE Systems Delivers Next-Generation Flight Hardware for U.S. Space Force Missile Warning Program

05/18/2026 | BAE Systems
BAE Systems has delivered the sensor subassembly and sensor system controller components for the Next Generation Overhead Persistent Infrared Polar (NGP) program.
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