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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Marelli, Microchip Pioneer Open-Standard Display Connectivity for Software-Defined Vehicles

09/03/2026 | PRNewswire
Marelli, a global automotive supplier, and Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a new solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open standard for automotive video connectivity.

MKS Highlights Laser and Chemistry Solutions at KPCA Show 2026

09/03/2026 | Atotech
MKS Inc. will showcase integrated manufacturing solutions in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at KPCA Show 2026 held at Songdo Convensia in Incheon, South Korea, from September 9–11. Visitors can meet MKS’ representatives at booth 201 in hall 3 and discover the company’s latest solutions for advanced electronics manufacturing.

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

08/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).
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