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March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Akrometrix Discusses AI Chip Board Demands
March 27, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Paul Handler of Akrometrix discusses the evolving demands in PCB fabrication, particularly the surge in large-format, room-temperature boards for AI chips. He highlights the critical need for inline, real-time testing of heavy, high-value circuit boards and Akrometrix's strategic shift towards integrated Industry 4.0 solutions. Handler also highlights the engineering challenges and the company's positive outlook for industry growth.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Viscom AI Inspection Technology Explained
03/26/2026 | Real Time with... APEX EXPOJesper Lykke discusses how AI revolutionizes automated inspection and programming, significantly enhancing speed and accuracy. Viscom's V-Vision and ProVision software, featuring advanced AI integration.solutions for industry challenges like miniaturization and large circuit board inspection, serve the booming demand for data center and backplane boards.
Advanced Encapsulation Process with LPMS USA
03/27/2026 | Real Time with... APEX EXPOExplore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.
Koki: Customer-Driven Innovation in Materials
03/26/2026 | Real Time with... APEX EXPOKoki's innovative approach to customer-centric product development is highlighted in this show floor interview with Shantanu Joshi at APEX EXPO 2026. Learn how Koki collaborates with clients to create tailored silver and coating solutions, addressing challenges like voiding and enhancing reliability. The company's micro-alloying techniques and free analytical services designed to optimize performance and manage costs.
Global Expansion Insights with Sunshine Global Circuits
03/26/2026 | Real Time with... APEX EXPOJoin Dan Beaulieu and Jimmy Fang, VP of global development for Sunshine Global Circuits (SGC), in this booth interview. SGC has extensive global operations, including their new expansion in Malaysia. Fang outlines his company's commitment to high-tech PCB manufacturing and shares insights into their capabilities, market focus, and future growth strategies.
Schmoll America: Adapting to Customer Needs
03/27/2026 | Real Time with... APEX EXPOEvan Howard discusses the positive industry outlook, highlighting a customer shift towards appreciating advanced technical support and application insights. He emphasizes Schmoll America's commitment to partnership and their innovative solutions for PCB manufacturing, including microvias and picosecond lasers.