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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Insulectro: Advanced PCB Fabrication Materials
April 23, 2026 | Real Time with... APEX EXPOEstimated reading time: 1 minute
Explore advanced PCB fabrication materials with Insulectro's Dain Hertsgaard and Gabriel Zepeda. This interview covers Arlon's innovative polyimide and epoxy solutions, including low-flow options for flex materials and high-performance materials for HDI applications; Qnity's polyimide films for demanding environments, and DuPont Interra's capacitance films for enhanced reliability. Insulectro offers comprehensive service and a commitment to advancing circuit technology.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Rachael Temple - AlltematedSuggested Items
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.