Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development

04/14/2026 | PRNewswire
NASA selected Synopsys, Inc. and EMA to verify spacesuit compatibility with the lunar environment.

Teledyne Supports NASA Artemis II with Critical Technologies

04/09/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced its broad support of NASA’s Artemis II mission, with multiple Teledyne businesses delivering mission‑critical technologies that help power, protect, connect, and track America’s first crewed voyage around the Moon in more than 50 years.

Honeywell’s Mission-Critical Technologies Help Enable NASA's Crewed Artemis II Mission

04/08/2026 | Honeywell
Building on the success of the Artemis I mission, Honeywell has provided multiple critical technologies for NASA's Artemis II launch and ongoing mission around the moon.

Renesas’ Radiation-Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission

04/02/2026 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its radiation-hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1.

Sypris Wins Expanded Follow-On Award for Deep Space Program

01/21/2026 | Sypris Electronics LLC
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received an expanded follow-on award from a leading U.S. aerospace and defense contractor to produce and test circuit card assemblies for use in Orion spacecraft supporting the missions of NASA’s Artemis program. Production is scheduled to begin in 2026.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in