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Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder paste products. A formal presentation ceremony was held at the Productronica China trade show in Shanghai.
CW-807RS improves overall finished quality with soldering performance that aids in creating full, solid solder joints and improves wetting speeds and cycle times for electronics assembly and robotic soldering applications. Its inherent spatter-control and heat-resistance technology combine to improve the cleanliness of the finished assembly and soldering equipment, keeping sensitive components safe from potential harmful solder and flux spattering, even with elevated tip temperatures.
Indium12.9HF is specifically formulated to accommodate fine feature printing, as seen with 01005 components. It offers unprecedented stencil print transfer efficiency, works across a broad range of processes to boost SPI yields, and delivers best-in-class voiding performance, improving thermal management and reliability. In addition, Indium12.9HF demonstrates high oxidation resistance to protect metal surfaces during reflow, ensuring high-quality joints in tough thermal conditions.
"These awards recognize our team’s commitment to developing innovative solutions that address real manufacturing challenges,” Tim Twining, Indium Corporation Vice President of Sales, Marketing, and Technical Service, said. "Both CW-807RS and Indium12.9HF deliver the performance and reliability that today’s electronics applications need, and we’re honored that EM Asia has recognized our commitment to moving our industry forward and supporting our customers’ success."
