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Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing

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The AI Tipping Point: Transforming Global Material Supply Chains

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Connect the Dots: What Designers Should Know About Non-conductive Via Fill

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The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.
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