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Advanced Electronics Packaging Digest

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KYZEN’s Rueda and Bivens to Present at Parts Cleaning Conference 2026

06/25/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced that Fernando Rueda, KYZEN’s Global Product Line Director – Industrial, and Beth Bivins, KYZEN’s Global Product Line Manager - Solvents will each present at the 2026 Parts Cleaning Conference scheduled to take place Tuesday, July 7, 2026, at the Hilton Columbus Downtown in Columbus, OH.

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

Gov. Hochul, TTM Technologies Mark Opening of $130M Manufacturing Facility in Dewitt

06/24/2026 | New York State Government
Governor Kathy Hochul announced the completion of TTM Technologies, Inc.’s new manufacturing facility located in Central New York. A leading global manufacturer of technology solutions, the company’s new state-of-the-art manufacturing facility is co-located on approximately 23 acres adjacent to TTM’s existing production facility in the Town of DeWitt, Onondaga County.

Japan Accelerates ASSB Development, Supply Chain with $660M Government Subsidies

06/24/2026 | TrendForce
TrendForce's latest “2Q26 Global Solid-State Battery Industry Development Quarterly Report” reveals that the Japanese government has significantly expanded support for next-generation battery technologies in recent years.

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.
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