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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
May 1, 2026 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
In her new position, Rogers will lead global programs supporting the electronic design automation (EDA) and semiconductor ecosystem. She will oversee strategy, member initiatives, and high-impact events that connect EDA leaders, semiconductor companies, and system designers. Rogers replaces Robert P. Smith who has moved into an advisory role after serving as Executive Director for 11 years.
“Julie’s leadership, industry insight, and collaborative approach will bring fresh energy and new ideas to strengthen the ESD Alliance and deliver even greater value to our global members,” said Ajit Manocha, President and CEO, SEMI. “Her longstanding tenure with SEMI and the ESDA has given her a deep understanding of our members’ needs and the evolving semiconductor industry landscape. We extend our gratitude to Bob Smith for his leadership as Executive Director over the past 11 years and look forward to his continued support as an ESDA advisor.”
Rogers brings more than 30 years of experience driving growth, visibility, and alignment across complex, highly technical markets. She is widely recognized for her leadership in driving industry collaboration, technical conferences, executive engagement, and ecosystem development. Over the past decade, she served as Director of Marketing and Operations for ESDA, congruent with over seven years as Director of Marketing for SEMI Americas, where she led integrated marketing campaigns, digital strategy, member development, brand advancement, media trades, and public relations efforts.
Earlier in her career, Rogers founded and led a successful marketing firm specializing in large‑scale event planning and grant writing for healthcare technology and medical device companies. She also brings a strong background in broadcast media, further strengthening her ability to amplify thought leadership and industry impact. Rogers holds a Bachelor of Arts in Marketing from California State University, Sacramento.
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Sweeney Ng - CEE PCBSuggested Items
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
Teradyne Reports New Record High in Q1 2026
04/30/2026 | BUSINESS WIRETeradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.
SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026
04/30/2026 | SEMIThe SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.