Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing
Elementary, Mr. Watson: The Design Matrix—Revealing the Hidden Truths of Reality
FlexTech, a SEMI Technology Coalition, issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $500,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover total project cost.
- The RFP seeks proposals targeting FHE advances in the following areas:
- Flexible, Moldable Electronics
- Advanced Bonding Reliability
- Novel Flexible Energy Storage Beyond Conventional Architectures
- 2D Materials
Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2026 RFP for more details on the evaluation process.
Proposal Submissions
Full proposal submissions are due July 6, 2026. Awardees will be notified following the review of proposals by the RFP committee. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:
- Rationale
- Budget
- Collaboration value
- Dual-use (industry and military) applicability
- Relevance to the topics and the FHE ecosystem
- Schedules and milestones
- Reasonable and stretch deliverables
- Overall proposal quality
Informational Webinar on May 20, 2026
To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 20, 2026 at 10:00 a.m. PDT. A recording will be available for registrants unable to attend the event.
