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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IPC-1751 Builds Supply Chain Infrastructure for the Future

09/01/2026 | Nolan Johnson, I-Connect007
IPC-1751 Committee Chairs Nikki Johnson, VP of operations and regulatory at Source Intelligence, with over 20 years of experience in compliance standards, and Dr. N Nagaraj, a chemical engineer and former NASA contractor who helped develop early IPC compliance solutions, discuss IPC-1751, the newly adopted JSON-based standard that replaces the older XML format. In this roundtable-format conversation, Johnson and Nagaraj explain how IPC-1751 serves as a modular "envelope" that connects related standards (IPC 1752–1757, IPC-1782) for material composition, lab reports, and conflict minerals.

THECA 2026 Review: Innovating PCBs and Advanced Electronics

08/31/2026 | Marcy LaRont, I-Connect007
The Thailand Printed Circuit Association hosted its third annual trade show in the bustling city of Bangkok this past week, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.” Building on its success as a leading PCB industry exhibition, THECA has brought together the entire PCB value chain, creating a comprehensive platform for advanced electronics.

SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Next-Gen Technologies

08/28/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced keynotes and program highlights for this year’s SEMICON® West on October 13–15 at the Moscone Center in San Francisco. Registration is open.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2026 | Nolan Johnson, I-Connect007
This week, the Global Electronics Association published its monthly report on PCB fabrication and EMS bookings and shipments, and the numbers are extremely positive. In EMS, the three-month book-to-bill ratio stands at 1.29 for July. Year-to-date EMS bookings are at 11% over 2025. The picture is similar in PCB fabrication as well. Year-to-date bookings are up 33% over last year, and book-to-bill stands at 1.46.

Preparing for a New Laminate Supply Reality

08/26/2026 | Mark Goodwin, Ventec International Group
The global laminate industry has entered a period of structural change unlike anything seen in recent decades. Explosive investment in AI infrastructure, including AI servers, advanced networking, optical communications, and data centers, is driving demand for laminate materials at a pace the supply chain cannot match. The warning signs have been building for months. Extended lead times, repeated price increases, customer stockpiling, raw material allocation, and major capacity expansion announcements all point to an industry increasingly under strain. How prepared are individual companies to respond to these changes?
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